JCD 50g Solder Paste - Mild Rosin Flux for PCB & IC Welding | Metalworking Tool

Product Description

Features:

Excellent capacity of solder-stickiness.

Excellent Anti-wet Capacity.

Widely used on BGA, PGA, CSP packages and flip chip operation.

Suitable for multiple PCB reflow.

No-clean and Lead free for environmental protection.

Specification:

FLUX Type: RMA-625A

Volume: 10cc

Weight: 50g

Quantity: 1Pce

It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing.

Package Included:

1 x JCD 50g Solder Paste

Detail Pictures: