Japan Steel BGA Repair Stencil for iPhone 8 & 8P | Logic Board Chip Soldering Tool
$13.00
$15.98
-19% OFF
Global Shipping
Easy Returns
Secure Payment
Product Description
Features: Efficient: quick alignment for operating of reballing Easy: positioning pins for precise alignment Durable: Long Time Operating and Usage Lifetime Application Model: iphone 8 Plus, 8 Function: Repairing or fixing problem of iphone 6s Plus 6s processor Package includes: 1 x BGA Reballing Stencils for iPhone 8/8P Details pictures:Customer Reviews
No reviews yet. Be the first to review this product!
