Solder Paste Syringe for BGA Repair | Mobile Phone Chip Solder Paste | Tin Mud Patch
$12.00
$14.96
-20% OFF
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Product Description
Description:
Product Name: Solder Paste
Weight: 35g
Unit weight: 0.04 kg
Product volume: 15.0 cm * 10.0 cm * 10.0 cm
The product has good wettability, good resistance to dryness, and a relatively long shelf life at room temperature. It is suitable for mobile phone repair industry, computer digital, repair industry, precision circuit board SMT welding, BGAI welding, etc.!
Package Included:
1 X Solder Paste
Detail Pictures:
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