Qianli S450 BGA Reballing Stencil | For iPhone 5-8 Plus & 7G | Repair Tool
$17.00
$20.78
-18% OFF
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Product Description
Features:High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient. New patented phone X Middle Layer Motherboard for Phone X Middle layer motherboard. Assisting professionals to do Phone X BGA reballing in the most convenient and safest way. Specification:
Type: A: for PHone 5/5s B: for PHone 6/6p C: for PHone 6s/6sp D: for PHone 7/7p E: for PHone 8/8p Package included:
1 x BGA Reballing Tool Details pictures:
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