Features: The flux is very effective.IC and PCB for no corrosive.Only slightly higher than the boiling point of the melting point of the solder.Shape is similar to the butter-like paste. High bond strength, PH value neutral, insulation resistance, welding surface smooth. For mobile phones, PC cards and other sophisticated electronic chip-level flux welding. Package Included: 1 x 150g Yellow Paste Advance Quality Soldering Paste Detail Pictures:
Customer Reviews
No reviews yet. Be the first to review this product!