S500 3D BGA Reballing Stencil Kit | For iPhone 5-8 Plus & CPU Modules | Repair Tool
$9.00
$10.70
-16% OFF
Global Shipping
Easy Returns
Secure Payment
Product Description
Features:High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient. New patented phone X Middle Layer Motherboard for Phone X Middle layer motherboard. Assisting professionals to do Phone X BGA reballing in the most convenient and safest way. Specification:
Type: A7 CPU / A8 CPU / A9 CPU / A10 CPU / A11 CPU Package included:
1 x BGA Reballing Tool Details pictures:
Customer Reviews
No reviews yet. Be the first to review this product!
