Qianli GTR100 3D BGA Reballing Stencil | Hard Disk Module Tool for iPhone 5-8P

SKU: PBRT-05CCCC
In Stock (999 available)
$9.00 $11.18 -19% OFF
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Product Description

Features:
High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient. New patented phone X Middle Layer Motherboard for Phone X Middle layer motherboard. Assisting professionals to do Phone X BGA reballing in the most convenient and safest way. Specification:
Type: for PHone 7/7p / for PHone 6s/6sp / for PHone 6/6p Package included:
1 x BGA Reballing Tool Details pictures:

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