Features: High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient.New patented phone X Middle Layer Motherboard for Phone X Middle layer motherboard.Assisting professionals to do Phone X BGA reballing in the most convenient and safest way.Specification: Type: for PHone 7/7p / for PHone 6s/6sp / for PHone 6/6pPackage included: 1 x BGA Reballing ToolDetails pictures:
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