Features: Excellent solder adhesionExcellent moisture resistanceWidely used in BGA, PGA, CSP packaging and flip chip operationSuitable for multiple PCB reflowNo cleaning, no lead, environmental protection, no corrosionIt can be used for rework, ball or pin connection to BGA, PGA and CSP packages, and assembly operations such as flip chip connection to PWB substrates. This is an indispensable and useful tool in the BGA re-aggregation.Specification: Name: Kaisi K-338Ingredients: ALPHA FluxVolume: 10cc Package Included: 1 (OR 2) x Kaisi K-338 Solder Flux Detail Pictures:
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