Kafuter K-5203 80g CPU Thermal Paste - Heatsink Silicone Grease Adhesive
$10.00
$12.78
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Product Description
Features:This product is a neutral through reinforced silicone elastomer gel, both bonding effect, and good thermal conductivity (heat), thermal effect is excellent, with good resistance to high temperature curing adhesive Changes performance, long-term use will not fall off, no contact with the gap, the cooling effect is not reduced. Uses: The main application is to replace the thermal grease (paste) for the CPU and radiator, thyristor Intelligent control module and radiator, high-power electrical modules and heat sinks between the filling bonding.With this glue, you can remove the traditional way of connecting with cards and screws, resulting in a more reliable filling of heat, simpler processes, and more economical costs. Before Curing:Color: WhiteViscosity (CP): Thixotropic pasteDensity (g/cm3): 2.0~2.5 Table dry Time (25??,min): ??30 After Curing:Tensile strength (MPa): ??2.5Elongation at break (%): ??100Shear Strength (MPa): ??1.5Hardness (Shore A): 50~65Operating temperature range (??): -60~280Dielectric strength (kv/mm): ??18Dielectric constant (@60hz): 2.8Volume resistance (??.cm): 1x1015Thermal conductivity (w/(M.K)): 1.2 How to use: 1. Will be glued or coated surface finishing clean, remove rust, dust and oil and so on. 2. screw open pipe cap, the glue squeeze to have cleaned the surface, so that the distribution will be glued to the surface of the closure can be fixed. 3, will be glued or sealed good parts into the air, so that its natural curing. The curing process is a process of solidification from the surface to the interior, in less than 24 hours (room temperature and 55% relative humidity) will solidify the depth of 2-4mm, if the position is deeper, especially in the location of the air is not easy to contact, the full curing time will be prolonged, if the temperature is lower, curing time will be extended. 3. It is recommended that the user wait long enough to ensure that the bonding is not affected by the firmness and integrity of the adhesive before packaging the parts for further processing or to be bonded.
Note: After the operation is completed, unused glue should immediately tighten cap, sealed to save. When used again, if the seal has a little crust, it can be removed, do not affect the normal use.
Package Included:
1 x Kafuter K-5203 80g Heatsink CPU Thermal Conductive Silicone Glue
Detail Pictures:
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