Description:To remove the IP-X motherboard layering, we use the 185-degree layering process, which comes from our fine analysis of IP-X solder paste. It also relies on the special heating design and precise temperature control ability of SS-T12A.Heat only the areas where the IP-X motherboard needs to be removed to prevent improper heating.The dual bayonet design ensures that the IP-X motherboard is stable on the stage.High-purity copper is used as a negative film to ensure uniform and stable heat transfer and heating.T12A-AndroidT12A family adds Android motherboard heating system, more powerful-Suitable for most Android phone motherboard heating.-High-purity copper as the negative film, to ensure uniform and stable heat transfer and heating.-Special heating design and precise temperature control ability make maintenance more efficient and maintenance saferT12A-FaceSunshine T12A adds ID heating station, which is mainly used to repair ID cable and risk-free replacement of distance sensor.T12A-X3We have always adhered to the design of high and low grooves, which only heats the middle column and does not heat the CPU.Accurately locate the parts that need to be heated1. Suitable for IP X / XS / XS MAX motherboard repair heating disassembly, CPU and other components2.Silicone heat insulation, high temperature resistance, reduce the temperature of the bottom contact surface.3.High-purity copper is used as a negative film to ensure uniform heat transfer and heat stability. T12A-N11T12A mo bile phone repair heating station seriesIP 11 series motherboard heating stationSuitable for IP 11/11 Pro /11 Pro MaxFast and precise heating of the motherboard, double buckle reinforcement, local heating, safe and practical, easy to operateSilicone insulationThe motherboard is accurately positionedEasy to operation, small and portable, accurate position, efficient layering of the motherboardHigh-purity copper as a film to ensure uniform heat transfer and heatGood tool, made by SUNSHINEFrom the persistence and improvement of the processTemperature controlIC slotDouble buckle reinforcementRapid warmingThreaded interfacePartial heatingSilicone insulation Package Includes: 1 x Host (A, B, C, D, E, F, G for your choices) Details Pictures:
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