SP-X BGA Solder Paste for iPhone X - Middle Layer Motherboard Repair Tin Pulp
$33.00
$40.72
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Product Description
Features:High density, high impedance Pure alloy compositin Fine and sticky Stannum planting, not bubbing Silver containing highlight Model: SP-X Weight: 50g Size: 38 x 31 x 35mm Melting Point: 158??
Package Included:
1 x SP-X Middle Layer of BGA Motherboard Special Solder Paste
Detail Pictures:
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