BGA Solder Paste | No-Clean Lead-Free Flux for Ball Planting & Repair

Product Description

Description:

Weight: 0.15 kg

Product volume: 20.0 cm * 20.0 cm * 20.0 cm

Model: JN-200-YQ

Viscosity: 30 (Pa??S)

Granularity: 0 (um)

Alloy composition: flux paste

Activity: high

Type: BGA welding oil

Cleaning angle: no cleaning

Melting point: 80

Type: BGA solder paste

Working temperature: 250 (??)

Scope of application: Electronic wire welding, chips, electronic components, SMT, PCB, BGA, PGA, SMD maintenance and welding

Package Included:
1 X Solder Paste

Detail Pictures: