Japan Steel BGA Repair Stencil Tool for iPhone 7 & 7P - Logic Board IC Chip Soldering
$13.00
$15.98
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Product Description
Features: Efficient: quick alignment for operating of reballing Easy: positioning pins for precise alignment Durable: Long Time Operating and Usage Lifetime Application Model: iphone 7, 7P. Function: Repairing or fixing problem of iphone 7 7P processor. Package includes: 1 x BGA Reballing Stencils for iPhone 7/7P Details pictures:Customer Reviews
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